dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

• 骰子;色子
  Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
• 掷骰子游戏
  Diceis a game which is played using dice.
• VERB 把(食物)切成小块;将…切丁
  If youdicefood, you cut it into small cubes.
  1. Dice the onion...
     把洋葱切成丁。
  2. Add the crushed garlic and remaining diced vegetables.
     加入捣碎的大蒜和剩余的蔬菜丁。

双语例句

• Design and Implementation of Primary and Secondary Schools Admission Dicing System Based on Proximity Principle
  基于就近原则的中小学招生划片系统设计与实现
• Our process training would cover variety of topics from choosing the right blades to setting an appropriate dicing process for various materials and applications.
  我们的工艺培训可以涵盖不同的主题，包括面对不同材料和应用该如何选择合适的刀片到设置适当的工艺参数等。
• Freddy Krueger plays the vengeful monster who kills by slicing, dicing and chopping people who had murdered him.
  弗雷迪·克鲁格扮演一个复仇的魔鬼，他把那些杀害他的人一一肢解至死。
• Introduces the development of semiconductor industry, the characteristic of laser wafer dicing technology, the structure of laser wafer dicing machine, and the application in the production.
  介绍了半导体行业的发展，晶圆激光划片技术的特点、激光划片系统的组成与其在实际过程中应用。
• In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
  本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
• We are dicing for drinks.
  我们在掷骰子赌喝酒。
• After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
  通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
• A multiple beam, sub surface laser dicing technology is currently being developed, which will improve the productivity of such a process significantly.
  多光束内部激光划片技术正在开发中，它将显著提高产量。
• Design and Realization of CAN node for Full Automatic Dicing Saw
  全自动划片机中CAN总线节点设计与实现
• Study on Mechanism and Driving Error of θ Axis for the Abrasive Dicing Saw
  砂轮划片机θ向机构和传动误差分析